Exhibiting 2023 Hong Kong International Printing & Packaging Fair
On April 19-22, 2023, Leabonintl & Xinhonghai exhibiting the 2023 Hong Kong International Printing & Packaging Fair.
The Hong Kong International Printing & Packaging Fair brought together some of the most innovative and reliable suppliers in the industry, and Leabonintl was proud to be a part of it.
We showcased our core products and new products with supporting systems (various paper cups, bags, boxes, and bowls), and provided the most favorable promotional activities for exhibitors, winning widespread attention and praise from customers.
Our booth is located in the center of the exhibition hall, and there is an endless stream of visitors. The exhibitors warmly received numerous professional visitors.
We showcase the high-quality and environmentally friendly features of our products to exhibition customers through physical product displays. Many customers have gained a deep understanding of our products and services and have contacted our expert team.
We emphasize our choice of environmental protection and our focus on providing personalized one-on-one services to ensure that our customers are 100% satisfied with their orders.
As a supplier of disposable packaging solutions, we understand the importance of providing high-quality products at competitive prices. We are pleased to showcase our products and services at the exhibition, demonstrating our commitment to excellence. We also met many high-quality packaging machinery suppliers at this Packaging Fair, such as Grand Pack, Samful... They have developed many Great packaging machinery for our industry and offer sustainble packing solution.
Through this exhibition, leabonintl has greatly improved its brand awareness and reputation in the Asia Pacific region. We look forward to continuing to expand our influence and helping more businesses and organizations find perfect packaging solutions to meet their unique needs. Thank you all for visiting our booth. We look forward to serving you in the future.
